| PART |
Description |
Maker |
| TI201209G800 TI201209U310 TI201209G301 TI201209G60 |
SMD MULTILAYER FERRITE CHIP BEADS (HIGH CURRENT)
|
Frontier Electronics.
|
| MLB160808 MLB160808-0060AL MLB160808-0060AM MLB160 |
MULTILAYER TYPE HIGH CURRENT FERRITE CHIP BEAD
|
http://
List of Unclassifed Manufacturers
ETC
|
| BMB0603-PXA-XXX |
(BMB Series) High Current Surface Mount Multilayer Chip Beads
|
TT
|
| VJ3040 VJ3640 VJ4044 |
Surface Mount Multilayer Ceramic Chip Capacitors with Integrated Resistor for High Pulse Current Applications
|
Vishay Siliconix
|
| 0907X7R104Z2FB 0907X7R104Z2F4 0907X7R104Z2F5 0907X |
CAPACITOR, CERAMIC, MULTILAYER, 50 V, X7R, 0.1 uF, SURFACE MOUNT, 0907 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 25 V, C0G, 0.00082 uF, SURFACE MOUNT, 0704 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 25 V, C0G, 0.0082 uF, SURFACE MOUNT, 1706 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.082 uF, SURFACE MOUNT, 3439 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.00068 uF, SURFACE MOUNT, 0704 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 25 V, C0G, 0.06 uF, SURFACE MOUNT, 2725 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 25 V, Y5V, 0.68 uF, SURFACE MOUNT, 1706 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.068 uF, SURFACE MOUNT, 0907 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.0068 uF, SURFACE MOUNT, 0704 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.68 uF, SURFACE MOUNT, 2321 CHIP
|
Presidio Components, Inc.
|
| 0805B201M601YHT 0805B122M601YHT 0805B121M601YHT 08 |
CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.0002 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.0012 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.00012 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.0015 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.0011 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.0013 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.002 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.0016 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.001 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.00016 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.00018 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.00013 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.00015 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.0018 uF, SURFACE MOUNT, 0805 CHIP
|
Novacap
|
| BMB0603-P1A-600 BMB0603-P1A-601 BMB0805-P1A-600 BM |
High Current Surface Mount Multilayer Chip Beads, 0603 - 1812 Industry Sizes
|
BITECH[Bi technologies]
ETC[ETC]
List of Unclassifed Manufacturers
|
| CF252016-R15K CF252016-5R6K CF252016-R56K CF252016 |
MAGNETICS - CHIP INDUCTOR HIGH CURRENT 1 ELEMENT, 0.15 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
MAGNETICS - CHIP INDUCTOR HIGH CURRENT 1 ELEMENT, 5.6 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
MAGNETICS - CHIP INDUCTOR HIGH CURRENT 1 ELEMENT, 0.56 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
MAGNETICS - CHIP INDUCTOR HIGH CURRENT 1 ELEMENT, 22 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
Inductors .33uH 10% MultiLayer Hi Current 1 ELEMENT, 0.33 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
MAGNETICS - CHIP INDUCTOR HIGH CURRENT 1 ELEMENT, 27 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
MAGNETICS - CHIP INDUCTOR HIGH CURRENT 1 ELEMENT, 0.68 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
MAGNETICS - CHIP INDUCTOR HIGH CURRENT 1 ELEMENT, 15 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
MAGNETICS - CHIP INDUCTOR HIGH CURRENT 1 ELEMENT, 33 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
MAGNETICS - CHIP INDUCTOR HIGH CURRENT 1 ELEMENT, 0.27 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
MAGNETICS - CHIP INDUCTOR HIGH CURRENT 1 ELEMENT, 12 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
MAGNETICS - CHIP INDUCTOR HIGH CURRENT 1 ELEMENT, 2.7 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns, Inc.
BOURNS INC
|
| HKQ0603W1N1S-T-19 |
High-Q Multilayer Chip Inductors for High Frequency Applications (HK series Q type)[HKQ-W]
|
Taiyo Yuden (U.S.A.), I...
|
| HKQ04024N3J-T |
High-Q Multilayer Chip Inductors for High Frequency Applications
|
Taiyo Yuden (U.S.A.), I...
|
| HKQ0603W0N9B-T |
High-Q Multilayer Chip Inductors for High Frequency Applications
|
Taiyo Yuden (U.S.A.), I...
|
| HKQ0603W1N4S-T |
High-Q Multilayer Chip Inductors for High Frequency Applications
|
Taiyo Yuden (U.S.A.), I...
|
|
