| PART |
Description |
Maker |
| CI100505-5N6D CI100505-R10J CI100505-8N2J CI100505 |
Multi-Layer Chip Inductors 1 ELEMENT, 0.0015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0022 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns Inc.
Bourns, Inc.
|
| CYV15G0403DXB CYP15G0403DXB-BGC CYV15G0403DXB-BGI |
Physical Layer Devices : Video (SMPTE) PHYs
Physical Layer Devices : Multi-Protocol PHYs
Independent clock quad HOTLink II transceiver. Speed standard.
|
Cypress
|
| ADFC21 |
MULTI-LAYER DIELECTRIC FILTER
|
ABRACON[Abracon Corporation]
|
| ADFC13 |
MULTI-LAYER DIELECTRIC FILTER
|
ABRACON[Abracon Corporation]
|
| CE201210-10NJ CE201210-12NJ CE201210-18NJ CE201210 |
Multi-Layer Chip Inductors
|
Bourns Electronic Solut...
|
| CI160808-15NJ CI160808-1N8D CI160808-27NJ CI160808 |
Multi-Layer Chip Inductors
|
Bourns Electronic Solut...
|
| 2512063007Y0 |
MULTI-LAYER CHIP BEAD
|
Fair-Rite Products Corp.
|
| ZAM161KA001 |
Piezoelectric Multi-Layer Actuator
|
Thinking Electronic Industrial Co.,Ltd
|
| DAU01R103M-TA DAF01W103K DAF01R103M DAF01W103M DAF |
CERAMIC MULTI-LAYER AXIAL DA
|
Dubilier
|
| 2506031517Y0 |
MULTI-LAYER CHIP BEAD
|
Fair-Rite Products Corp.
|
