| PART |
Description |
Maker |
| BIR-BN03J4G |
END-LOOK PACKAGE LIGHT EMITTING DIODE
|
BRIGHT LED ELECTRONICS CORP
|
| BIR-BM1731 |
END-LOOK PACKAGE LIGHT EMITTING DIODE
|
Bright LED Electronics Corp.
|
| BIR-BM13E4G-2 |
17 Bit System Integrating A/D Processor, 16L PDIP
END-LOOK PACKAGE LIGHT EMITTING DIODE
|
Bright LED Electronics Corp.
|
| T7024-TRS T7024 T7024-PGP T7024-PGQ T7024-TRQ |
The T7024 is a monolithic SiGe transmit/receive front-end IC with power amplifier, low-noise amplifier and T/R switch driver. It is especially designed for operation in TDMA systems like Bluetooth and WDCT.
BluetoothISM 2.4-GHz Front- End IC
Bluetooth?ISM 2.4-GHz Front- End IC
Bluetooth⑩/ISM 2.4-GHz Front- End IC
Bluetooth/ISM 2.4-GHz Front- End IC
|
Atmel Corp.
ATMEL[ATMEL Corporation]
|
| BIR-BM13K4Q |
END-LOOK PACKAGE GHT EMITTING DIODE
|
Bright LED Electronics Corp.
|
| BS115 |
CAN PACKAGE PHOTODIODE FOR VISIBLE LIGHT
|
SHARP[Sharp Electrionic Components]
|
| 2SB815 |
Ultrasmall package allows miniaturization in end products. low-saturation voltage.
|
TY Semiconductor Co., Ltd
|
| TEMT6200F |
Ambient Light Sensor in 0805 Package
|
Vishay Siliconix
|
| OP270 OP272 |
Infrared Light Emitting Diode in SMD Plastic Package
|
Optek Technology
OPTEK Technologies
|
| L130-2280001400001 L130-2580001400001 L130-2780001 |
Hot-color targeted industry standard package for uniform light
|
Lumileds Lighting Compa...
|
| AND4GA |
GaP Ultra Bright Green Light Emission Surface Mount Package
|
Purdy Electronics Corporation
|
