| PART |
Description |
Maker |
| 04307-2 04307 |
HEATSINK, VERTICAL MINI MOD
|
VICOR[Vicor Corporation]
|
| 05738 05738-2 |
HEATSINK CROSSFLOW, MINI MOD (40 HG, SLOTTED) 散热器横流，迷你国防部（40汞，开槽）
HEATSINK CROSSFLOW MINI MOD (40 HG SLOTTED)
|
Vicor, Corp.
VICOR[Vicor Corporation]
|
| 5-146256-2 |
HEADER ASSEMBLY, MOD II, BREAKAWAY, DOUBLE ROW, VERTICAL, HIGH TEMPERATURE
|
Tyco Electronics
|
| 102100-1 |
.156 Inch Centerline-Cable to Board AMPMODU .031 x .062 Interconnection System (Mod I); MOD I RECP PLTD 15 SEL ( AMP )
|
Tyco Electronics
|
| 3-103321-0 3-103321-1 3-103321-7 3-103321-9 3-1033 |
ASSEMBLY, HEADER, BREAKAWAY, MOD II, SINGLE ROW, .100 C/L, VERTICAL, WITH .025 SQUARE POSTS
|
Tyco Electronics
|
| 35317-2020 0353172020 |
4.20mm (.165) Pitch Mini-Fit? Header, Dual Row, Vertical, 20 Circuits, PA Polyamide(Nylon) 6/6 94V-2, White
4.20mm (.165") Pitch Mini-Fit庐 Header, Dual Row, Vertical, 20 Circuits, PA Polyamide(Nylon) 6/6 94V-2, White
4.20mm (.165") Pitch Mini-Fit垄莽 Header, Dual Row, Vertical, 20 Circuits, PA Polyamide(Nylon) 6/6 94V-2, White
|
Molex Electronics Ltd.
|
| 0366330039 36633-0039 |
4.20mm (.165) Mini-Fit Jr. Header, Vertical, Nylon, without Flange, 18Circuits
|
Molex Electronics Ltd.
|
| 0366330029 36633-0029 |
4.20mm (.165) Mini-Fit Jr. Header, Vertical, Nylon, without Flange, 24Circuits
|
Molex Electronics Ltd.
|
| 0366330033 36633-0033 |
4.20mm (.165) Mini-Fit Jr. Header, Vertical, Nylon, without Flange, 2 Circuits
|
Molex Electronics Ltd.
|
| STK15C88 STK15C88-N25 STK15C88-N25I STK15C88-N35 S |
HEATSINK TO-220 DUAL MT W/CLIPS 32K的8自动存储非易失高性能CMOS非易失性静态随机存储器
HEATSINK TO-218 10W H=2.5 BLK 32K的8自动存储非易失高性能CMOS非易失性静态随机存储器
HEAT SINK .720 HIGH RISE TO-220 32K的8自动存储非易失高性能CMOS非易失性静态随机存储器
32K x 8 AutoStore nvSRAM High Performance CMOS Nonvolatile Static RAM 32K的8自动存储非易失高性能CMOS非易失性静态随机存储器
|
Electronic Theatre Controls, Inc.
List of Unclassifed Manufacturers
ETC[ETC]
SIMTEK
|
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