| PART |
Description |
Maker |
| ICS280PGLF ICS280 ICS280PG ICS280PGILF ICS280PGI |
From old datasheet system
Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) 封装和封装尺寸（16引脚TSSOP封装173军医。体
|
Integrated Circuit Solu...
ICSI[Integrated Circuit Solution Inc]
Intersil, Corp.
|
| SC70-5 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
| SOD523 |
Surface mounted, 2 pin package Package outline
|
Zetex Semiconductors
|
| AP2305AGN-HF |
3.2 A, 30 V, 0.06 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| DFN2X2-10 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN5X5-40 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN2X2-12 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN3X4-20 |
Package Outline
|
Global Mixed-mode Techn...
|
| SOT223 |
Package Outline
|
Global Mixed-mode Techn...
|
| WLCSP8X7-56 |
Package Outline
|
Global Mixed-mode Techn...
|
| SOD882 |
Package outline
|
STANFORD[Stanford Microdevices]
|
