PART |
Description |
Maker |
B72500TXXXX B72500VXXXX B72530VXXXX B72540VXXXX B7 |
(B725xxTxxxx) Multilayer technology (B725xxVxxxx) Multilayer technology
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EPCOS
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CT1210KXXG |
Multilayer technology
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EPCOS
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MLVS0603M07 MLVS0603M04 MLVS0603M06 MLVS-0603 MLVS |
This specification is applicable to Chip Metal Oxide Varistor in multilayer technology
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List of Unclassifed Manufacturers ETC[ETC]
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PIC18F4580-I_ML PIC18F4580-I_P PIC18F4580-I_PT PIC |
28/40/44-Pin Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology
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Microchip Technology
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UP025SL120J-B-BZ UP025SL150J-B-BZ UP025SL010D-B-BZ |
CAPACITOR, CERAMIC, MULTILAYER, 50 V, SL, 0.000012 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 50 V, SL, 0.000015 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 50 V, SL, 0.000001 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 50 V, SL, 0.00001 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.0047 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.018 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.0027 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.0039 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.0022 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.0015 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.0018 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.0056 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.012 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.022 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.0012 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.0033 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.01 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.0068 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT
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Taiyo Yuden Co., Ltd.
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SIGC07T60SNC |
IGBT Chip in NPT-technology 600V NPT technology positive temperature coefficient
|
Infineon Technologies AG
|
0805B201M601YHT 0805B122M601YHT 0805B121M601YHT 08 |
CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.0002 uF, SURFACE MOUNT, 0805 CHIP CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.0012 uF, SURFACE MOUNT, 0805 CHIP CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.00012 uF, SURFACE MOUNT, 0805 CHIP CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.0015 uF, SURFACE MOUNT, 0805 CHIP CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.0011 uF, SURFACE MOUNT, 0805 CHIP CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.0013 uF, SURFACE MOUNT, 0805 CHIP CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.002 uF, SURFACE MOUNT, 0805 CHIP CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.0016 uF, SURFACE MOUNT, 0805 CHIP CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.001 uF, SURFACE MOUNT, 0805 CHIP CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.00016 uF, SURFACE MOUNT, 0805 CHIP CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.00018 uF, SURFACE MOUNT, 0805 CHIP CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.00013 uF, SURFACE MOUNT, 0805 CHIP CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.00015 uF, SURFACE MOUNT, 0805 CHIP CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.0018 uF, SURFACE MOUNT, 0805 CHIP
|
Novacap
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PIC18F4680 PIC18F4585 PIC18LF4680-I301 PIC18LF4680 |
Enhanced Flash Microcontrollers with ECAN? Technology, 10-Bit A/D and nanoWatt Technology Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology
|
MICROCHIP[Microchip Technology]
|
Q67040S4722 Q67040S4724 IGP30N60T IGW30N60T |
1200V IGBT for frequencies up to 10kHz for hard switching applications and up to 30kHz for soft switching. Combined Trench- and Fieldstop-Technology. ... LOW LOSS IGBT IN TRENCH AND FILEDSTOP TECHNOLOGY
|
INFINEON[Infineon Technologies AG]
|
ILBB0603-RK300V ILBB0603RK300V ILBB-0603 |
Multilayer Ferrite Bead Multilayer Ferrite Beads SWITCH DIP 8POS SIDE ACT LONG
|
VISAY[Vishay Siliconix] Vishay Intertechnology,Inc.
|
2222207556 2238207556 2255207555 2250207555 222220 |
General Purpose & High Capacitance SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS SURFACE-MOUNT CERAMICV MULTILAYER CAPACITORS This specification describes X7R series chip capacitors with lead-free terminations SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS SURFACE-MOUNT CERAMICV MULTILAYER CAPACITORS
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YAGEO Corporation List of Unclassifed Manufac...
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