PART |
Description |
Maker |
V826532K04S |
2.5 VOLT 32M x 64 HIGH PERFORMANCE UNBUFFERED DDR SDRAM MODULE
|
Mosel Vitelic Corp MOSEL[Mosel Vitelic, Corp]
|
V436532S04VATG-75 |
3.3 VOLT 32M x 64 HIGH PERFORMANCE PC133 UNBUFFERED SDRAM MODULE
|
MOSEL[Mosel Vitelic, Corp] Mosel Vitelic Corp
|
V827332K04S |
2.5 VOLT 32M x 72 HIGH PERFORMANCE UNBUFFERED ECC DDR SDRAM MODULE
|
Mosel Vitelic, Corp. MOSEL[Mosel Vitelic, Corp] Mosel Vitelic Corp
|
AT45DB321B-RI AT45DB321B-TI AT45DB321B-RC AT45DB32 |
CABLE ASSEMBLY; N MALE TO N MALE; 50 OHM, RG178B/U COAX 32M X 1 FLASH 2.7V PROM, PBGA44 32-megabit 2.7-volt Only DataFlash 32兆位2.7伏只的DataFlash 32-megabit 2.7-volt Only DataFlash 32M X 1 FLASH 2.7V PROM, PDSO28
|
Atmel Corp. Atmel, Corp.
|
AT45DB321B AT45DB321B-CC AT45DB321B-CI AT45DB321B- |
From old datasheet system 32M bit, 2.7-Volt Only Serial Interface Flash with two 528-Byte SRAM Buffers 32-megabit 2.7-volt Only DataFlash
|
ATMEL[ATMEL Corporation]
|
V436632S24VXTG-75PC V436632S24V V436632S24VXTG-10P |
IC ARM920T MCU 200MHZ 352-PBGA 3.3 VOLT 32M x 64 HIGH PERFORMANCE PC133 UNBUFFERED SDRAM MODULE
|
Mosel Vitelic, Corp. MOSEL[Mosel Vitelic, Corp] Mosel Vitelic Corp
|
KMM372V3280BK3 |
32M x 72 DRAM DIMM(32M x 72 动RAM模块) 32M × 72配置的DRAM内存2M × 72配置动态内存模块)
|
Samsung Semiconductor Co., Ltd.
|
KMM372V3200BS1 |
32M x 72 DRAM DIMM(32M x 72 动RAM模块) 32M × 72配置的DRAM内存2M × 72配置动态内存模块)
|
Samsung Semiconductor Co., Ltd.
|
R01AN1504EJ0100 |
Using the DTC to Perform Continuous Clock
|
Renesas Electronics Corporation
|
28F320C3 |
3 Volt Advanced Boot Block Flash Memory(3 V 高级快速引导块闪速存储器) 32M X 8 FLASH 3V PROM
|
Intel, Corp.
|
S70WS512N00BAWA20 S70WS512N00BAWAA3 S70WS512N00BFW |
Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory
|
SPANSION[SPANSION]
|
1760 |
WOODHEAD? TESTERS PERFORM BASIC-VERIFICATION AND MULTIFUNCTION WIRE TESTING WITH COMPACT, SIMPLE-TO-USE DEVICES THAT
|
Molex Electronics Ltd.
|