| PART |
Description |
Maker |
| DCR1020SF65 DCR1020SF DCR1020SF60 DCR1020SF61 DCR1 |
Chip-on-Glass (COG) Technology, 16 Characters x 2 Lines
Phase Control Thyristor
|
DYNEX SEMICONDUCTOR LTD
DYNEX[Dynex Semiconductor]
|
| HDG320240 320240 |
Chip On Glass technology 320 X 240 Dots Graphics
Chip On Glass technology 在玻璃芯片技
|
List of Unclassifed Manufacturers
ETC[ETC]
Hantronix,Inc
Electronic Theatre Controls, Inc.
|
| NHD-C160100AZ-RN-GBW |
COG (Chip-On-Glass) Liquid Crystal Display Module
|
Newhaven Display International, Inc.
|
| HDG12864F-1 |
Chip On Glass Technology
|
Hantronix,Inc
|
| THM322020S-10 THM322020S-80 THM322020SG-10 THM3220 |
Chip-on-Glass (COG) Technology, 16 Characters x 2 Lines
2097152 WORDS x 32 BIT DYNAMIC RAM MODULE
2,097,152 WORDS x 32 BIT DYNAMIC RAM MODULE
2/097/152 WORDS x 32 BIT DYNAMIC RAM MODULE
|
Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
|
| LEUWS2W-PXQX-4P7R |
compact lightsource in multi chip SMT technology with glass window on top
|
OSRAM GmbH
|
| SIGC03T60SNC |
IGBT Chip in NPT-technology 600V NPT technology 100μm chip
|
Infineon Technologies AG
|
| BC10-12 |
Absorbent Glass mat technology for efficient gas recombinatino
|
B. B. Battery Co., Ltd.
|
| LEAQ7WP-NXPX-23 |
compact lightsource in SMT technology with glass window on top
|
OSRAM GmbH
|
| HRC9-12 |
Absorbent Glass mat technology for efficient gas recombinatino
|
B. B. Battery Co., Ltd.
|
| VSM1206 VSM1206KCBT VSM1206KDBT VSM1206KDBW VSM120 |
Bulk Metal? Foil Technology Discrete High Precision Surface Mount Chip Resistor
Bulk Metal庐 Foil Technology Discrete High Precision Surface Mount Chip Resistor
Bulk Metal垄莽 Foil Technology Discrete High Precision Surface Mount Chip Resistor
Bulk Metal㈢ Foil Technology Discrete High Precision Surface Mount Chip Resistor
|
VISAY[Vishay Siliconix]
|
