PART |
Description |
Maker |
DSP56374 DSP56374PB DSP56374PB_D DSP56374UM DSP563 |
high density CMOS device with 3.3 V inputs and outputs
|
MOTOROLA[Motorola, Inc]
|
ATV2500B-15KM/883 ATV2500BL-20KM/883 ATV2500BQL-30 |
High-Speed High-Density UV Erasable Programmable Logic Device OT PLD, 20 ns, PDIP40 High-Speed High-Density UV Erasable Programmable Logic Device UV PLD, 30 ns, CQCC44 High-Speed High-Density UV Erasable Programmable Logic Device UV PLD, 15 ns, CQCC44 High-Speed High-Density UV Erasable Programmable Logic Device UV PLD, 25 ns, CQCC44 High-Speed High-Density UV Erasable Programmable Logic Device OT PLD, 25 ns, PQCC44 High-Speed High-Density UV Erasable Programmable Logic Device UV PLD, 25 ns, CDIP40 High-Speed High-Density UV Erasable Programmable Logic Device OT PLD, 25 ns, PDIP40 ER 4C 4#8 SKT RECP BOX Seals Circular Connector; MIL SPEC:MIL-C-5015 E/F/R; Body Material:Aluminum Alloy; Series:MS3102; No. of Contacts:14; Connector Shell Size:22; Connecting Termination:Solder; Circular Shell Style:Box Mount Receptacle; Gender:Female RoHS Compliant: No Circular Connector; No. of Contacts:14; Series:; Body Material:Aluminum Alloy; Connecting Termination:Solder; Connector Shell Size:22; Circular Contact Gender:Pin; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:22-19 RoHS Compliant: No ER 14C 14#16 SKT RECP CONTROL KNOB RoHS Compliant: Yes ER 3C 3#8 SKT RECP BOX ER 7C 7#16 PIN RECP ER 3C 1#16 2#8 PIN RECP BOX ER 9C 9#16 PIN RECP
|
Atmel, Corp. Atmel Corp. http:// ATMEL Corporation
|
MACH211SP-12 MACH211SP-7JC MACH211SP-7VC MACH211SP |
RES 35.7K-OHM 1% 0.1W 100PPM THICK-FILM SMD-0603 5K/REEL-7IN-PA SCREW MACHINE SLOTTED 6-32X3/4 High-Density EE CMOS Programmable Logic EE PLD, 16 ns, PQCC44 High-Density EE CMOS Programmable Logic 高密度电子工程CMOS可编程逻辑
|
Advanced Micro Devices, Inc. ADVANCED MICRO DEVICES INC
|
ISPLSI1032EA-170LT100 ISPLSI1032EA-200LT100 1032EA |
60 MHz in-system prommable high density PLD 170 MHz in-system prommable high density PLD 125 MHz in-system prommable high density PLD 100 MHz in-system prommable high density PLD Shielded Paired Cable; Number of Conductors:8; Conductor Size AWG:24; No. Strands x Strand Size:7 x 32; Jacket Material:Polyethylene; Shielding Material:Aluminum Foil/Polyester Tape/Tinned Copper Braid; Number of Pairs:4 RoHS Compliant: Yes In-System Programmable High Density PLD 在系统可编程高密度可编程逻辑器件
|
LATTICE[Lattice Semiconductor] Lattice Semiconductor Corporation Lattice Semiconductor, Corp.
|
MACH215-15JC MACH215-20JC MACH215-12JC MACH215-12 |
High-Density EE CMOS Programmable Logic High-Density EE CMOS Programmable Logic EE PLD, 20 ns, PQCC44 High-Density EE CMOS Programmable Logic EE PLD, 15 ns, PQCC44
|
LATTICE SEMICONDUCTOR CORP Lattice Semiconductor, Corp.
|
MACH130-15 MACH130-15JC MACH130-20JC |
High-Density EE CMOS Programmable Logic
|
LATTICE[Lattice Semiconductor]
|
MACH445-20YC |
High-Density EE CMOS Programmable Logic
|
Lattice Semiconductor Corporation
|
MACH110-15JC |
High-Density EE CMOS Programmable Logic
|
Lattice Semiconductor Corporation
|
CLA80000 |
High Density CMOS Gate Arrays
|
Zarlink Semiconductor
|
MACH435Q-20JC MACH435Q-25JC MACH435-12JC |
High-Density EE CMOS Programmable Logic EE PLD, 12 ns, PQCC84
|
Lattice Semiconductor Corporation Lattice Semiconductor, Corp.
|
IDT72V211110PFI IDT72V2111L15PF |
3.3 VOLT HIGH DENSITY CMOS SUPERSYNC FIFO 3.3伏高密度CMOS SUPERSYNC先进先出
|
Integrated Device Technology, Inc.
|
ISPLSI1024 ISPLSI1024EA-200LT100 1024EA ISPLSI1024 |
200 MHz in-system prommable high density PLD Shielded Paired Cable; Number of Conductors:8; Conductor Size AWG:28; No. Strands x Strand Size:7 x 36; Jacket Material:Polyethylene; Number of Pairs:4; Features:Alumunium Foil Polyester/Tinned Copper Braid; Impedance:120ohm RoHS Compliant: Yes In-System Programmable High Density PLD 100 MHz in-system prommable high density PLD
|
Lattice Semiconductor Corporation LATTICE[Lattice Semiconductor] http://
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