| PART |
Description |
Maker |
| ANTDB1HDPXXX |
Product Description
|
List of Unclassifed Man...
|
| SBW-5089 SBW-5089Z SBW-50891 |
Product Description InGaP/GaAs HBT MMIC Amplifier
|
SIRENZA MICRODEVICES
|
| TMP86C847 TMP86C846 TMP86CH46 TMP86CH47 TMP86CK74 |
The product information available by this search method contains an overview of each product only.
|
TOSHIBA
|
| HM5164400LJ-5 HM5165400LJ-5 HM5165400J-5 HM5164400 |
IEC 61754-6; HRS No: 710-0087-3 40; Mating/Unmating Cycles: 500; Operating Temperature Range (degrees C): -25 to 70; Generic Name: MU; General Description: Cap
IEC 61754-6; HRS No: 710-0076-7 00; Insertion Loss (dB): 0.5; Return Loss (dB)(Min.): 40; Generic Name: MU; General Description: Plug insertion/extraction tool
x4 Fast Page Mode DRAM x4快速页面模式的DRAM
|
3M Company
|
| 8XC251SA 8XC251TA1 |
Hardware Description
|
Intel Corporation
|
| KA7307D |
GENERAL DESCRIPTION
|
Samsung semiconductor
|
| BT132 |
TRANSISTOR
GENERAL DESCRIPTION
|
TY Semicondutor
TY Semiconductor Co., Ltd
|
| KS7308 |
FCM
GENERAL DESCRIPTION
|
Samsung Electronic
Samsung semiconductor
|
| 2SP0115T |
Description and Application Manual
|
Concept
|
