| PART |
Description |
Maker |
| DSF20060SF60 DSF20060SF DSF20060SF55 DSF20060SF56 |
Fast Recovery Diode
Chip-on-Glass (COG) Technology, 16 Characters x 2 Lines 620 A, 5500 V, SILICON, RECTIFIER DIODE
|
DYNEX SEMICONDUCTOR LTD
DYNEX[Dynex Semiconductor]
Dynex Semiconductor, Ltd.
|
| NHD-C160100AZ-RN-GBW |
COG (Chip-On-Glass) Liquid Crystal Display Module
|
Newhaven Display International, Inc.
|
| NHD-C0220BIZ-FS-FBW-3VM |
COG (Chip-On-Glass) Character Liquid Crystal Display Module
|
Newhaven Display Intern...
|
| THM402020SG-10 THM402020SG-80 |
Chip-on-Glass (COG) Technology, 16 Characters x 2 Lines
2,097,152 WORDSx40 BIT DYNAMIC RAM MODULE
2/097/152 WORDSx40 BIT DYNAMIC RAM MODULE
|
Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
|
| THM401020SG-80 |
Chip-on-Glass (COG) Technology, 16 Characters x 2 Lines 1,048,576 WORDSx40位动态RAM模块
1,048,576 WORDSx40 BIT DYNAMIC RAM MODULE
1/048/576 WORDSx40 BIT DYNAMIC RAM MODULE
|
Toshiba, Corp.
Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
|
| 1602F HDG1602F |
Chip On Glass technology
|
List of Unclassifed Manufacturers
ETC[ETC]
Electronic Theatre Controls, Inc.
|
| THM361020S-10 THM361020S-80 THM361020SG-10 THM3610 |
Chip-on-Glass (COG) Technology, 16 Characters x 2 Lines
1048576 WORDS x 36 BIT DYNAMIC RAM MODULE
1,048,576 WORDS x 36 BIT DYNAMIC RAM MODULE
1/048/576 WORDS x 36 BIT DYNAMIC RAM MODULE
|
Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
|
| THM322020S-10 THM322020S-80 THM322020SG-10 THM3220 |
Chip-on-Glass (COG) Technology, 16 Characters x 2 Lines
2097152 WORDS x 32 BIT DYNAMIC RAM MODULE
2,097,152 WORDS x 32 BIT DYNAMIC RAM MODULE
2/097/152 WORDS x 32 BIT DYNAMIC RAM MODULE
|
Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
|
| SP3220B SP3220BCA SP3220BCT SP3220BCY SP3220BEA SP |
High Speed 3.0V to 5.5V RS-232 Driver/Receiver Pair
Low Power 5V RS232 Dual Driver/Receiver with 0.1?μF Capacitors; Package: SO; No of Pins: 16; Temperature Range: -40?°C to 85?°C
320 x 240 pixel format, Chip-On-Glass Technology 高.0V.5V的RS - 232驱动接收
|
SIPEX[Sipex Corporation]
|
| SIGC07T60SNC |
IGBT Chip in NPT-technology 600V NPT technology positive temperature coefficient
|
Infineon Technologies AG
|
| BC10-12 |
Absorbent Glass mat technology for efficient gas recombinatino
|
B. B. Battery Co., Ltd.
|
| FT231XS-X FT231XQ-X DSFT231X FT231XQ-T FT231XS-R |
Future Technology Devices International Ltd FT231X
Single chip USB to asynchronous serial data transfer interface
Future Technology Devices International Ltd.
|
List of Unclassifed Manufacturers
Future Technology Devices I...
Future Technology Devic...
|
