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Molex Electronics Ltd.
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Part No. |
87914-2815 0879142815
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Description |
2.54mm (.100) pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) plating, tray packaging, Lead-free 2.54mm (.100) pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) plating, tray packaging, Lead-free 2.54mm (.100) pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) plating, tray packaging, Lead-free
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File Size |
3,777.37K /
48 Page |
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it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
87914-3616 0879143616
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Description |
2.54mm (.100) pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall plating, tray packaging, Lead-free 2.54mm (.100) pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall plating, tray packaging, Lead-free 2.54mm (.100) pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall plating, tray packaging, Lead-free
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File Size |
3,779.41K /
48 Page |
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it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
87914-2216 0879142216
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Description |
2.54mm (.100) pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall plating, tray packaging, Lead-free 2.54mm (.100) pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall plating, tray packaging, Lead-free 2.54mm (.100) pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall plating, tray packaging, Lead-free
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File Size |
3,779.50K /
48 Page |
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it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
0528304432 52830-4432
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Description |
Modular Jack, Right Angle, 4/4, 0.76μm (30μ) Gold (Au) plating, with Beveled Metalpins, tray packaging, Lead-free Modular Jack, Right Angle, 4/4, 0.76楼矛m (30楼矛") Gold (Au) plating, with Beveled Metalpins, tray packaging, Lead-free
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File Size |
113.00K /
3 Page |
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it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
0528304422 52830-4422
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Description |
Modular Jack, Right Angle, 4/4, 0.38渭m (15渭") Gold (Au) plating, with Beveled Metalpins, tray packaging, Lead-free Modular Jack, Right Angle, 4/4, 0.38μm (15μ) Gold (Au) plating, with Beveled Metalpins, tray packaging, Lead-free
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File Size |
112.82K /
3 Page |
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it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
87891-0408
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Description |
2.54mm (.100) pitch KK庐 Header, Through Hole, Vertical, 4 Circuit, 2.50渭m (100渭) Tin (Sn) Overall plating, tray packaging, Lead-free 2.54mm (.100) pitch KK? Header, Through Hole, Vertical, 4 Circuit, 2.50μm (100μ) Tin (Sn) Overall plating, tray packaging, Lead-free
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File Size |
287.76K /
5 Page |
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it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
87891-0606
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Description |
2.54mm (.100) pitch KK庐 Header, Through Hole, Breakaway, Vertical, 6 Circuits, 2.50渭m (100渭) Tin (Sn) Overall plating, tray packaging, Lead-free 2.54mm (.100) pitch KK? Header, Through Hole, Breakaway, Vertical, 6 Circuits, 2.50μm (100μ) Tin (Sn) Overall plating, tray packaging, Lead-free
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File Size |
759.44K /
10 Page |
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it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
87891-4006
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Description |
2.54mm (.100) pitch KK庐 Header, Through Hole, Breakaway, Vertical, 40 Circuits, 2.50渭m (100渭) Tin (Sn) Overall plating, tray packaging, Lead-free 2.54mm (.100) pitch KK? Header, Through Hole, Breakaway, Vertical, 40 Circuits, 2.50μm (100μ) Tin (Sn) Overall plating, tray packaging, Lead-free
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File Size |
759.44K /
10 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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