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  53612-G34-4 Datasheet PDF File

For 53612-G34-4 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |   

    STG3482QTR STG3482

STMicroelectronics
Part No. STG3482QTR STG3482
Description Low voltage dual SP4T switch

File Size 193.88K  /  14 Page

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Amphenol Communications Solutions

Part No. 53612-S40-8LF
Description Quickie Header, Wire to Board Connector, Double Row, 40 Positions, 2.54 mm (0.1 in.), Vertical Header 0.38 um (15 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    DMG3401LSN-7

Diodes Incorporated
Part No. DMG3401LSN-7
Description Low Input Capacitance

File Size 182.52K  /  6 Page

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Amphenol Communications Solutions

Part No. 53612-S26-7
Description Quickie Header, Wire to Board Connector, Double Row, 26 Positions, 2.54 mm (0.1 in.), Vertical Header 0.38 um (15 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    TC7SG34AFS

Toshiba, Corp.
Toshiba Semiconductor
Part No. TC7SG34AFS
Description Zener Diode; Application: General; Pd (mW): 500; Vz (V): 3.1 to 3.5; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V): &#160; ESD (kV) min: -; Package: LLD 非逆变
Non-Inverter

File Size 168.83K  /  6 Page

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Amphenol Communications Solutions

Part No. 53612-G14-6
Description Quickie Header, Wire to Board Connector, Double Row, 14 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    Vishay Semiconductors
Part No. DG3409DB-T2-E1 DG3408DB-T2-E1
Description
File Size 149.78K  /  14 Page

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Amphenol Communications Solutions

Part No. 53612-S10-7
Description Quickie Header, Wire to Board Connector, Double Row, 10 Positions, 2.54 mm (0.1 in.), Vertical Header 0.38 um (15 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    XLMDKVG34M

List of Unclassifed Manufacturers
ETC[ETC]
Part No. XLMDKVG34M
Description T-1(3mm) BI-COLOR INDICATOR LAMP

File Size 265.75K  /  4 Page

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Amphenol Communications Solutions

Part No. 53612-S26-6
Description Quickie Header, Wire to Board Connector, Double Row, 26 Positions, 2.54 mm (0.1 in.), Vertical Header 0.38 um (15 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    TY Semiconductor Co., Ltd
Part No. DMG3401LSN-7
Description 30V P-CHANNEL ENHANCEMENT MODE MOSFET Low Input Capacitance

File Size 106.70K  /  2 Page

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Amphenol Communications Solutions

Part No. 53612-S20-8LF
Description Quickie Header, Wire to Board Connector, Double Row, 20 Positions, 2.54 mm (0.1 in.), Vertical Header 0.38 um (15 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    ST Microelectronics
Part No. STG3482QTR
Description Low Voltage Dual SP4T Switch with Break-Before-Make Feat.

File Size 199.46K  /  14 Page

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Amphenol Communications Solutions

Part No. 53612-G16-4
Description Quickie Header, Wire to Board Connector, Double Row, 16 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    74HC3G34GD

NXP Semiconductors
Part No. 74HC3G34GD
Description Triple buffer gate

File Size 179.87K  /  14 Page

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Amphenol Communications Solutions

Part No. 53612-G20-7
Description Quickie Header, Wire to Board Connector, Double Row, 20 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    TY Semiconductor Co., Ltd
Part No. DMG3407SSN DMG3407SSN-7
Description P-CHANNEL ENHANCEMENT MODE MOSFET Low On-Resistance

File Size 115.55K  /  2 Page

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Amphenol Communications Solutions

Part No. 53612-G50-4LF
Description Quickie Header, Wire to Board Connector, Double Row, 50 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    TY Semiconductor
Part No. DMG3401LSN
Description P-CHANNEL ENHANCEMENT MODE MOSFET

File Size 124.21K  /  2 Page

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Amphenol Communications Solutions

Part No. 53612-G34-4LF
Description Quickie Header, Wire to Board Connector, Double Row, 34 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

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