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  70567-0008 Datasheet PDF File

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    WAP-0008

Level One
Part No. WAP-0008
Description Wireless 11g Wireless Access Point with SATA/IDE Storage

File Size 161.37K  /  3 Page

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Amphenol Cables on Demand

Part No. CS-VHDCIMX200-008
Description Amphenol CS-VHDCIMX200-008 VHDCI SCSI (SCSI-5) LVD/SE Cable - .8mm 68-pin VHDCI SCSI Male to Male 8m
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    IPS-0008

Level One
Part No. IPS-0008
Description LevelOne IPS-0008 provides users with the

File Size 258.08K  /  3 Page

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Texas Instruments

Part No. JM38510/00801BDA
Description Hex Inverter Buffers/Drivers With Open-Collector High-Voltage Outputs 14-CFP -55 to 125
Tech specs    

Official Product Page

    0015800145 15-80-0145 70567-0141

Molex Electronics Ltd.
Part No. 0015800145 15-80-0145 70567-0141
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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Texas Instruments

Part No. JM38510/00801BCA
Description Hex Inverter Buffers/Drivers With Open-Collector High-Voltage Outputs 14-CDIP -55 to 125
Tech specs    

Official Product Page

    0015800147 15-80-0147 A-70567-0209

Molex Electronics Ltd.
Part No. 0015800147 15-80-0147 A-70567-0209
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating

File Size 1,218.31K  /  7 Page

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Texas Instruments

Part No. JM38510/00803BDA
Description Hex Buffers/Drivers With Open-Collector High-Voltage Outputs 14-CFP -55 to 125
Tech specs    

Official Product Page

    0015800381 70567-0017 15-80-0381

Molex Electronics Ltd.
Part No. 0015800381 70567-0017 15-80-0381
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, Tin (Sn) Plating

File Size 1,218.40K  /  7 Page

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Texas Instruments

Part No. M38510/00801BCA
Description Hex Inverter Buffers/Drivers With Open-Collector High-Voltage Outputs 14-CDIP -55 to 125
Tech specs    

Official Product Page

    0015800149 15-80-0149 A-70567-0277

Molex Electronics Ltd.
Part No. 0015800149 15-80-0149 A-70567-0277
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.39K  /  7 Page

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Texas Instruments

Part No. M38510/00803BCA
Description Hex Buffers/Drivers With Open-Collector High-Voltage Outputs 14-CDIP -55 to 125
Tech specs    

Official Product Page

    0015800165 15-80-0165 70567-0142 A-70567-0142

Molex Electronics Ltd.
Part No. 0015800165 15-80-0165 70567-0142 A-70567-0142
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating,

File Size 1,218.25K  /  7 Page

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Texas Instruments

Part No. JM38510/00803BCA
Description Hex Buffers/Drivers With Open-Collector High-Voltage Outputs 14-CDIP -55 to 125
Tech specs    

Official Product Page

    0015800169 15-80-0169 A-70567-0278

Molex Electronics Ltd.
Part No. 0015800169 15-80-0169 A-70567-0278
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.39K  /  7 Page

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Texas Instruments

Part No. M38510/00801BDA
Description Hex Inverter Buffers/Drivers With Open-Collector High-Voltage Outputs 14-CFP -55 to 125
Tech specs    

Official Product Page

    A-70567-0363 15-80-1501 0015801501

Molex Electronics Ltd.
Part No. A-70567-0363 15-80-1501 0015801501
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating

File Size 1,218.39K  /  7 Page

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Texas Instruments

Part No. M38510/00803BDA
Description Hex Buffers/Drivers With Open-Collector High-Voltage Outputs 14-CFP -55 to 125
Tech specs    

Official Product Page

    0015800281 70567-0012 15-80-0281

Molex Electronics Ltd.
Part No. 0015800281 70567-0012 15-80-0281
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
MOLEX Connector

File Size 1,218.43K  /  7 Page

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Renesas Electronics Corporation

Part No. RQA0008RXDQS#H1
Description N-Channel MOSFET
Tech specs    

Official Product Page

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