| |
|
 |
Amphenol Communications Solutions |
| Part No. |
131-3316-11H
|
| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left End Wall, Backplane Module, 1.5mm Wipe, APP.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
69133-168HLF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 68 Positions, 2.54 mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
69133-162HLF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 62 Positions, 2.54 mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
131-3316-21D
|
| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
44133-1600 SD-44133-001 0441331600
|
| Description |
3.00mm (.118) Micro-Fit 3.0 BMI Receptacle Housing, Dual Row, Panel Mount, 16 Circuits, PBT Polyester, UL 94V-0
3.00mm (.118") Micro-Fit 3.0 BMI Receptacle Housing, Dual Row, Panel Mount, 16 Circuits, PBT Polyester, UL 94V-0
|
| File Size |
170.76K /
2 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
69133-164HLF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 64 Positions, 2.54 mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
10118744-3133169LF
|
| Description |
C - Commercial Series; Mezzanine Receptacle, SMT; 1mm Pitch; 69p
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
131-3316-11D
|
| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
69133-166HLF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 66 Positions, 2.54 mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
131-3316-21H
|
| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left End Wall, Backplane Module, 2.25mm Wipe, APP.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
69133-160HLF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 60 Positions, 2.54 mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
|
Bom2Buy.com
Price and Availability
|
