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  2NBS08-TF1-330LF Datasheet PDF File

For 2NBS08-TF1-330LF Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    7N90L-TF1-T 7N90G-TF1-T

Unisonic Technologies
Part No. 7N90L-TF1-T 7N90G-TF1-T
Description 900V N-CHANNEL POWER MOSFET

File Size 165.50K  /  6 Page

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Amphenol Communications Solutions

Part No. 66902-330LF
Description Quickie Header, Wire to Board Connector, Standard Dual Beam - Double row - 30 Positions - 2.54 mm (0.1 in.) .
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    9N80L-TF1-T 9N80G-TF1-T

Unisonic Technologies
Part No. 9N80L-TF1-T 9N80G-TF1-T
Description 9 Amps, 800 Volts N-CHANNEL POWER MOSFET

File Size 170.19K  /  5 Page

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Amphenol Communications Solutions

Part No. 66900-330LF
Description Quickie Header, Wire to Board Connector, Standard Dual Beam - Double row - 30 Positions - 2.54 mm (0.1 in.) .
Tech specs    

Official Product Page

    Omron
Part No. PTF14A-E
Description Relay

File Size 925.50K  /  2 Page

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Amphenol Communications Solutions

Part No. 68682-330LF
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Through Hole, Dual Entry, Double Row, 60 Position ,2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    TOSHIBA[Toshiba Semiconductor]
Part No. TF1206
Description SOLID STATE IGBT GATE DRIVER MODULE

File Size 232.84K  /  5 Page

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Amphenol Communications Solutions

Part No. 87061-330LF
Description Quickie®, Wire to Board Connector, Double Row, 120 Positions, 2.54 mm (0.1 in.), Right Angle, Eject Latch Header 30u\\/0.76um GXT™ Mating Plating
Tech specs    

Official Product Page

    TOSHIBA
Part No. TF1106
Description SOLID STATE I/O INTERFACE MODULE AC INPUT MODULE

File Size 157.68K  /  3 Page

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Amphenol Communications Solutions

Part No. 91812-330LF
Description Minitek® 2.00mm, Board to Board Connector, PCB Mounted Receptacle , Vertical , Surface Mount, Top Entry, Double row, 30 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    TOSHIBA
Part No. TF1107
Description SOLID STATE I/O INTERFACE MODULE DC INPUT MODULE

File Size 157.11K  /  3 Page

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Amphenol Communications Solutions

Part No. 76745-103-30LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 30 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    TOSHIBA
Part No. TF1108
Description SOLID STATE I/O INTERFACE MODULE AC OUTPUT MODULE

File Size 182.48K  /  4 Page

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Amphenol Communications Solutions

Part No. 89891-330LF
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Dual Entry , 60 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    TOSHIBA
Part No. TF1109
Description SOLID STATE I/O INTERFACE MODULE DC OUTPUT MODULE

File Size 172.26K  /  4 Page

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Amphenol Communications Solutions

Part No. 77317-803-30LF
Description BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 30 Positions ,2.54mm (0.100in) Pitch,
Tech specs    

Official Product Page

    TEMEX COMPONENTS
Part No. TF1103
Description 10 MHz - 150 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER

File Size 29.97K  /  1 Page

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Amphenol Communications Solutions

Part No. 89892-330LF
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounetd Receptacle, Vertical, Through Hole, Dual Entry, Double row , 60 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    KOA
Part No. TF16AT
Description thin film chip fuse

File Size 159.26K  /  2 Page

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Amphenol Communications Solutions

Part No. 51939-330LF
Description PwrBlade®, Power Connectors, 2P 24S 2P Right Angle Header, Solder To Board
Tech specs    

Official Product Page

For 2NBS08-TF1-330LF Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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